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Neoh (left) and Prof Ewe (right) 
	exchanging the MoU
The Fourth Industrial Revolution is paving the way 
	for transformative changes in the way we live and radically changing almost 
	every business sector. It is a fusion of advances in artificial intelligence 
	(AI), robotics, the Internet of Things (IoT), genetic engineering, quantum 
	computing, and more. 
In line with the global growth, 
	UTAR and TF AMD 
	Microelectronics (Penang) Sdn Bhd (TF AMD) conducted a virtual ceremony for 
	the exchange of memorandum of understanding (MoU) via Zoom on 5 February 
	2021. The MoU and memorandum of agreement (MoA) were signed digitally on 4 
	December 2020 and 18 December 2020 respectively.
With the signing of this MoU, UTAR and TF AMD will 
	officially begin their strategic partnership to initiate joint projects or 
	researches on automated robotics technology, staff and student exchanges, 
	study visits, industrial placement opportunities, co-supervision of the 
	postgraduate studies and etcetera. The MoU will enable both parties to work 
	even more closely in creating platforms which will enrich both staff and 
	students’ academic experience, as well as empowering them to explore 
	learning opportunities beyond the classrooms.
The signatories for the MoU were UTAR President Ir Prof Dr Ewe Hong Tat and TF AMD Managing Director Neoh Soon Ee. It was witnessed by UTAR R&D and Commercialisation Vice President Prof Ts Dr Faidz bin Abd Rahman and ATMP Engineering and Factory Automation Engineering Senior Manager Tai Ewe Shin.
Also present at the virtual ceremony were Malaysian Investment Development Authority (MIDA) Senior Deputy Director Noor Suziyanti Saad, MIDA Assistant Director Ahmad Tarmizi Ab Aziz, TF AMD Factory Automation Engineering Manager Ng Woon Ji, Institute of Postgraduate Studies and Research Director Dr Yong Thian Khok, Division of Community and International Networking (DCInterNet) Director Assoc Prof Dr Lai Soon Onn, DCInterNet Deputy Director of Kampar Campus Dr Chen I-Chi, Lee Kong Chian Faculty of Engineering and Science (LKC FES) Dean Ir Prof Dr Goi Bok Min, LKC FES R&D and Postgraduate Programmes Deputy Dean Ts Dr Yap Wun She, LKC FES Head of Mechatronics and BioMedical Engineering Department Dr Kwan Ban Hoe, UTAR staff and distinguished guests from TF AMD and MIDA.
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Prof Ewe emphasising on the importance 
	of partnership with industry for the development of students and staff 
Speaking at the ceremony, Prof Ewe thanked TF AMD for 
	the research grant and said, “I would first welcome TF AMD Mr Neoh and MIDA 
	for joining us at this virtual ceremony. I would like to thank Mr Neoh for 
	this collaboration and thank you for your research grant of RM404,250.00 for 
	UTAR to undertake this collaborative research project in automated robotics 
	technology.”
He added, “This is a good opportunity for both 
	parties to come together to share knowledge and expertise for a win-win 
	partnership on this research project together. This is also our University’s 
	initiative to collaborate with the industry on projects so that our staff 
	and students are updated on industry needs and at the same time, we can 
	share and exchange resources as the way forward. Such collaborations also 
	enrich our staff and students’ educational experience which is crucial and 
	invaluable as part of university education and especially for students 
	seeking employment later.”
“We are in this fourth industrial revolution and the 
	emergence of AI post a lot of challenges to the industry and also higher 
	education sector, therefore we have to work together with the industry to 
	make sure our students are trained to meet the demand of the market and at 
	the same time get our staff involved in joint collaboration and research. We 
	are thankful to TF AMD for the opportunity of allowing our students to be 
	attached to them for industrial placements and study visits because this 
	will help our students gain the necessary real-life skills, experience and 
	knowledge required for their employment later on. And also not to forget 
	MIDA for all the support to the university,” Prof Ewe emphasised. 
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Neoh looking forward to having a 
	successful partnership and he is glad to support and sponsor UTAR
On the other hand, Neoh enthused, “We are very glad 
	and excited to have this collaboration with UTAR. I looked forward to having 
	a successful partnership and we are very glad to support and sponsor UTAR in 
	the automated robotics technology project. This project is very important 
	and if this is successful, we would love to use in our production floor as 
	one of the advance automation features.” 
	
He added, “I would also like to thank MIDA, the 
	government's principal agency for their support. MIDA is Malaysia's 
	cutting-edge, dynamic and pioneering force in opening pathways to new 
	frontiers around the globe and assists companies which intend to invest in 
	the manufacturing and services sectors, as well as facilitating the 
	implementation of their projects. The wide ranges of services provided by 
	MIDA include providing information on the opportunities for investments, as 
	well as facilitating companies which are looking for joint venture partners. 
	TF AMD with the assistance of MIDA will continue to help and grow the local 
	establishment such as local universities or local industries and from there 
	we will be growing together.”
The ceremony moved on with a presentation given by LKC FES lecturer Ir Danny Ng Wee Kiat on automation and robotics.
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Danny introducing some projects and 
	sharing insights on automation and robotics at the ceremony
The MoU exchange ceremony ended with a souvenir 
	presentation to Neoh, followed by a group photography session. 
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A group photo at the end of the 
	virtual exchange ceremony
TF AMD background info:
TF AMD is the 1st company in the world to assemble and 
	test the leading microprocessor which provides a customer-preferred world 
	class leading semiconductor assembly and test capabilities and scale to 
	competing with the rest of the international market and services. TF AMD is 
	an outsourced semiconductor assembly and test company providing wafer-level 
	chip scale packaging services, wafer back grind, die prep services, final 
	test and wafer sort and other related services for AMD and its customers.
	
	
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